Paper
27 March 2012 Peeling stress analysis of piezo-bonded laminated composite plate
Bin Huang, Heung Soo Kim
Author Affiliations +
Abstract
A stress function based method is proposed to analyze the interlaminar stresses at the free edge of a piezo-bonded composite laminated structure. Two piezoelectric actuators are symmetrically surface bonded on composite laminate. Same electric fields are applied to the two symmetric piezoelectric actuators which can generate induced strain, resulting in pure extension on the laminated plate. The stresses that satisfy the traction-free boundary conditions at the free edge and at the top and bottom surfaces of the laminate were obtained by using the complementary virtual work principle. Cross-ply and angle-ply laminates were analyzed. To verify the proposed method, the stress concentrations predicted by the present method were compared with those analyzed by the finite element method. The results provided that the stress function based analysis of piezo-bonded laminated composite structure is an efficient and accurate method for initial design stage of piezo-composite structure.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Bin Huang and Heung Soo Kim "Peeling stress analysis of piezo-bonded laminated composite plate", Proc. SPIE 8341, Active and Passive Smart Structures and Integrated Systems 2012, 834129 (27 March 2012); https://doi.org/10.1117/12.913018
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KEYWORDS
Composites

Actuators

Finite element methods

Interfaces

Ferroelectric materials

Stress analysis

Aerospace engineering

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