Optimization method of photolithography process by means of atomic force microscopy

Andrzej Sierakowski; Paweł Janus; Daniel Kopiec; Konrad Nieradka; Krzysztof Domanski; Piotr Grabiec; Teodor Gotszalk

doi:10.1117/12.918024

16 April 2012 Optimization method of photolithography process by means of atomic force microscopy

Andrzej Sierakowski, Paweł Janus, Daniel Kopiec, Konrad Nieradka, Krzysztof Domanski, Piotr Grabiec, Teodor Gotszalk

Proceedings Volume 8352, 28th European Mask and Lithography Conference; 83520B (2012) https://doi.org/10.1117/12.918024
Event: 28th European Mask and Lithography Conference (EMLC 2012), 2012, Dresden, Germany

Abstract

In this article authors present a method for determining optimal photoresist exposure parameters in a photolithography process by an analysis of a topographic profile of exposed images in a photoresist layer. As a measurement tool an Atomic Force Microscopy (AFM) integrated with a system for maskless lithography was used. The measurement system with the piezoresistive cantilever and experimental procedure was described. Initial experiments result of determining the optimal exposure energy and minimizing the stitching error method were presented.

Citation Download Citation

Andrzej Sierakowski, Paweł Janus, Daniel Kopiec, Konrad Nieradka, Krzysztof Domanski, Piotr Grabiec, and Teodor Gotszalk "Optimization method of photolithography process by means of atomic force microscopy", Proc. SPIE 8352, 28th European Mask and Lithography Conference, 83520B (16 April 2012); https://doi.org/10.1117/12.918024

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