Paper
15 October 2012 Large aperture ratio machining of the Z-cut quartz base on MEMS technology
Haihe Xie, Xiaogfeng Jiang, Chun Lin, Xizhao Lu, Yuanqing Huang
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Abstract
It is difficult to process quartz to get a large aperture ratio micropore(Φ127μm) by the mechanical tools, but it is possible processed by MEMS technology. The fluorine etching technology is used in experiments. The etching rate of quartz is proportional to the concentration of the HF acid. The etching rate of the mixtures of different proportions of the HF acid (49%) and the NH4F solution (35%) can be acquired, and the etching rate is lower if NH4F solution (35%) replace by the saturated NH4F solution. The experimental results conform to the chemical equation of Judge J S. In the experiment of the micropore etch, the wafers are respectively put in the mixtures of 1:1 and 3:2 ratio of the hydrofluoric acid (49%) and the ammonium fluoride solution (40%), and the morphology of micropore can be observed by the scanning electron microscopy and the confocal microscopy, and then the deepest depth of the micropore is tested by the confocal microscopy, the relationship between etching rate and the proportional of mixed solution can be got.
© (2012) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Haihe Xie, Xiaogfeng Jiang, Chun Lin, Xizhao Lu, and Yuanqing Huang "Large aperture ratio machining of the Z-cut quartz base on MEMS technology", Proc. SPIE 8418, 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Design, Manufacturing, and Testing of Smart Structures, Micro- and Nano-Optical Devices, and Systems, 84181B (15 October 2012); https://doi.org/10.1117/12.956754
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KEYWORDS
Etching

Quartz

Crystals

HF etching

Semiconducting wafers

Microelectromechanical systems

Confocal microscopy

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