Warpage and thermal stress analysis of hybrid infrared focal plane assembly

Xing Chen; Fengmei Dong; Kai He; Jianxin Wang; Qingyao Zhang

doi:10.1117/12.977431

15 October 2012 Warpage and thermal stress analysis of hybrid infrared focal plane assembly

Xing Chen, Fengmei Dong, Kai He, Jianxin Wang, Qingyao Zhang

Proceedings Volume 8419, 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Sensing, Imaging, and Solar Energy; 84191B (2012) https://doi.org/10.1117/12.977431
Event: 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies (AOMATT 2012), 2012, Xiamen, China

Abstract

Hybrid infrared focal plane array detector is always a heterogeneous components assembly. The thermal expansion mismatch between the components, HgCdTe detector chip and silicon readout integrated circuit, combined with large thermal variations (300 K-80 K), results in substantial thermal stress in the interconnection layer and large warpage of the whole assembly. In this paper, the thermal stress distribution and warpage of the assembly are analyzed by finite element method. The results show that the thickness of sapphire electrical lead board, Si-ROIC and GaAs substrate have influences on the thermal stress distribution and warpage of the assembly, and the warpage is affected significantly. Furthermore, we adopt the theoretical formula of multilayer structure to calculate the warpage of IRFPA module. The simulation results are in good agreement with those obtained from the theory. In order to improve the reliability of the IRFPA detector, the assembly is optimized according to the analysis result. After optimizing, the warpage of the assembly decreases from -10.2 um to -5.5 um, the maximum Von Mises Stress in HgCdTe layer decreases by 15.5%, and the uniformity of thermal stress distribution is improved effectively.

Citation Download Citation

Xing Chen, Fengmei Dong, Kai He, Jianxin Wang, and Qingyao Zhang "Warpage and thermal stress analysis of hybrid infrared focal plane assembly", Proc. SPIE 8419, 6th International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optoelectronic Materials and Devices for Sensing, Imaging, and Solar Energy, 84191B (15 October 2012); https://doi.org/10.1117/12.977431

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
6 PAGES

DOWNLOAD PAPER SAVE TO MY LIBRARY

GET CITATION

RIGHTS & PERMISSIONS

Get copyright permission Get copyright permission on Copyright Marketplace

KEYWORDS

Mercury cadmium telluride

Sensors

Sapphire

Gallium arsenide

Lead

Staring arrays

Finite element methods

Show All Keywords

Keywords/Phrases

Search In:

Publication Years