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25 September 2012 Enabling large focal plane arrays through mosaic hybridization
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We have demonstrated advances in mosaic hybridization that will enable very large format far-infrared detectors. Specifically we have produced electrical detector models via mosaic hybridization yielding superconducting circuit paths by hybridizing separately fabricated sub-units onto a single detector unit. The detector model was made on a 100mm diameter wafer while four model readout quadrant chips were made from a separate 100mm wafer. The individually fabricated parts were hybridized using a flip-chip bonder to assemble the detector-readout stack. Once all of the hybridized readouts were in place, a single, large and thick silicon substrate was placed on the stack and attached with permanent epoxy to provide strength and a Coefficient of Thermal Expansion match to the silicon components underneath. Wirebond pads on the readout chips connect circuits to warm readout electronics; and were used to validate the successful superconducting electrical interconnection of the model mosaic-hybrid detector. This demonstration is directly scalable to 150 mm diameter wafers, enabling pixel areas over ten times the area currently available.
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Timothy M. Miller, Christine A. Jhabvala, Edward Leong, Nicholas P. Costen, Elmer Sharp, Tomoko Adachi, and Dominic J. Benford "Enabling large focal plane arrays through mosaic hybridization", Proc. SPIE 8453, High Energy, Optical, and Infrared Detectors for Astronomy V, 84532H (25 September 2012);

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