Paper
13 March 2013 Resonant biaxial 7-mm MEMS mirror for omnidirectional scanning
U. Hofmann, M. Aikio, J. Janes, F. Senger, V. Stenchly, M. Weiss, H.-J. Quenzer, B. Wagner, W. Benecke
Author Affiliations +
Abstract
Low-cost automotive laser scanners for environment perception are needed to enable the integration of advanced driver assistant systems (ADAS) into all automotive vehicle segments, a key to reducing the number of traffic accidents on roads. An omnidirectional 360 degree laser scanning concept has been developed based on combination of an omnidirectional lens and a biaxial large aperture MEMS mirror. This omnidirectional scanning concept is the core of a small sized low-cost time-of-flight based range sensor development. This paper describes concept, design, fabrication and first measurement results of a resonant biaxial 7mm gimbal-less MEMS mirror that is electrostatically actuated by stacked vertical comb drives. Identical frequencies of the two resonant axes are necessary to enable the required circle scanning capability. A tripod suspension was chosen since it allows minimizing the frequency splitting of the two resonant axes. Low mirror curvature is achieved by a thickness of the mirror of more than 500 μm. Hermetic wafer level vacuum packaging of such large mirrors based on multiple wafer bonding has been developed to enable to achieve a large mechanical tilt angle of +/- 6.5 degrees in each axis. The 7mm-MEMS mirror demonstrates large angle circular scanning at 1.5kHz.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
U. Hofmann, M. Aikio, J. Janes, F. Senger, V. Stenchly, M. Weiss, H.-J. Quenzer, B. Wagner, and W. Benecke "Resonant biaxial 7-mm MEMS mirror for omnidirectional scanning", Proc. SPIE 8616, MOEMS and Miniaturized Systems XII, 86160C (13 March 2013); https://doi.org/10.1117/12.2006189
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Cited by 4 scholarly publications and 1 patent.
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KEYWORDS
Mirrors

Microelectromechanical systems

Semiconducting wafers

Glasses

Sensors

Packaging

Silicon

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