Paper
25 March 2013 Improvement in etching rate for epilayer lift-off with surfactant
Fan-Lei Wu, Ray-Hua Horng, Jian-Heng Lu, Chun-Li Chen, Yu-Cheng Kao
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Abstract
In this study, the GaAs epilayer is quickly separated from GaAs substrate by epitaxial lift-off (ELO) process with mixture etchant solution. The HF solution mixes with surfactant as mixture etchant solution to etch AlAs sacrificial layer for the selective wet etching of AlAs sacrificial layer. Addiction surfactants etchant significantly enhance the etching rate in the hydrofluoric acid etching solution. It is because surfactant provides hydrophilicity to change the contact angle with enhances the fluid properties of the mixture etchant between GaAs epilayer and GaAs substrate. Arsine gas was released from the etchant solution because the critical reaction product in semiconductor etching is dissolved arsine gas. Arsine gas forms a bubble, which easily displaces the etchant solution, before the AlAs layer was undercut. The results showed that acetone and hydrofluoric acid ratio of about 1:1 for the fastest etching rate of 13.2 μm / min. The etching rate increases about 4 times compared with pure hydrofluoric acid, moreover can shorten the separation time about 70% of GaAs epilayer with GaAs substrate. The results indicate that etching ratio and stability are improved by mixture etchant solution. It is not only saving the epilayer and the etching solution exposure time, but also reducing the damage to the epilayer structure.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Fan-Lei Wu, Ray-Hua Horng, Jian-Heng Lu, Chun-Li Chen, and Yu-Cheng Kao "Improvement in etching rate for epilayer lift-off with surfactant", Proc. SPIE 8620, Physics, Simulation, and Photonic Engineering of Photovoltaic Devices II, 86201Y (25 March 2013); https://doi.org/10.1117/12.2004237
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Cited by 2 patents.
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KEYWORDS
Etching

Gallium arsenide

Epitaxial lateral overgrowth

HF etching

Nickel

Semiconducting wafers

Electroplating

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