Optimization of the hybrid silicon photonic integrated circuit platform

Martijn J. R. Heck; Michael L. Davenport; Sudharsanan Srinivasan; Jared Hulme; John E. Bowers

doi:10.1117/12.2002967

4 March 2013 Optimization of the hybrid silicon photonic integrated circuit platform

Martijn J. R. Heck, Michael L. Davenport, Sudharsanan Srinivasan, Jared Hulme, John E. Bowers

Proceedings Volume 8640, Novel In-Plane Semiconductor Lasers XII; 86400U (2013) https://doi.org/10.1117/12.2002967
Event: SPIE OPTO, 2013, San Francisco, California, United States

Abstract

In the hybrid silicon platform, active III/V based components are integrated on a silicon-on-insulator photonic integrated circuit by means of wafer bonding. This is done in a self-aligned back-end process at low temperatures, making it compatible with CMOS-based silicon processing. This approach allows for low cost, high volume, high quality and reproducible chip fabrication. Such features make the hybrid silicon platform an attractive technology for applications like optical interconnects, microwave photonics and sensors operating at wavelengths around 1.3 μm and 1.55 μm. For these applications energy efficient operation is a key parameter. In this paper we present our efforts to bring the III/V components in the hybrid silicon platform, such as lasers and optical amplifiers, on par with the far more mature monolithic InP-based integration technology. We present our development work to increase hybrid silicon laser and amplifier wall-plug efficiency. This is done by careful optimization of III/V mesa geometry and guiding silicon waveguide width. We also discuss current injection efficiency and thermal performance. Furthermore we show the characterization of the low-loss and low-reflection mode converters that couple the hybrid III/V components to silicon waveguides. Reflections below -41 dB and passive loss of 0.3 dB per converter were obtained.

Citation Download Citation

Martijn J. R. Heck, Michael L. Davenport, Sudharsanan Srinivasan, Jared Hulme, and John E. Bowers "Optimization of the hybrid silicon photonic integrated circuit platform", Proc. SPIE 8640, Novel In-Plane Semiconductor Lasers XII, 86400U (4 March 2013); https://doi.org/10.1117/12.2002967

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available