Multiple-field approach for aberration correction in miniature imaging systems based on wafer-level production

Eric Logean; Toralf Scharf; Nicolas Bongard; Hans Peter Herzig; Markus Rossi

doi:10.1117/12.2004390

7 March 2013 Multiple-field approach for aberration correction in miniature imaging systems based on wafer-level production

Eric Logean, Toralf Scharf, Nicolas Bongard, Hans Peter Herzig, Markus Rossi

Author Affiliations +

Proceedings Volume 8667, Multimedia Content and Mobile Devices; 86671E (2013) https://doi.org/10.1117/12.2004390
Event: IS&T/SPIE Electronic Imaging, 2013, Burlingame, California, United States

Abstract

In mobile imaging systems, the most difficult element to integrate is the objective lens. Here we present an intermediate approach between the costly traditional objectives and the low-resolution objectives inspired by the compound eyes of insects. Our multi-field approach uses a small number of optical channels each imaging a portion of the desired field of view. The full-field image is reconstructed digitally. The optics of each channel is kept simple for wafer-level fabrication and its size is sufficient to obtain a reasonable resolution. We present the design and fabrication of a prototype using 9 plano-convex lenses for 9 channels. Glass lenses glued on a wafer are used to image a full-field of ±40° with an f-number of 3. The images obtained shows field curvature correction. A simple image reconstruction scheme is presented. In conclusion, multi-field objectives fabricated with micro-optics technology are thin, simple to mount, robust, and easily replicated.

Citation Download Citation

Eric Logean, Toralf Scharf, Nicolas Bongard, Hans Peter Herzig, and Markus Rossi "Multiple-field approach for aberration correction in miniature imaging systems based on wafer-level production", Proc. SPIE 8667, Multimedia Content and Mobile Devices, 86671E (7 March 2013); https://doi.org/10.1117/12.2004390

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