Using process monitor wafers to understand directed self-assembly defects

Yi Cao; YoungJun Her; Paulina Rincon Delgadillo; Nadia Vandenbroeck; Roel Gronheid; Boon Teik Chan; Yukio Hashimoto; Ainhoa Romo; Mark Somervell; Kathleen Nafus; Paul F. Nealey

doi:10.1117/12.2011658

26 March 2013 Using process monitor wafers to understand directed self-assembly defects

Yi Cao, YoungJun Her, Paulina Rincon Delgadillo, Nadia Vandenbroeck, Roel Gronheid, Boon Teik Chan, Yukio Hashimoto, Ainhoa Romo, Mark Somervell, Kathleen Nafus, Paul F. Nealey

Author Affiliations +

Proceedings Volume 8680, Alternative Lithographic Technologies V; 86801S (2013) https://doi.org/10.1117/12.2011658
Event: SPIE Advanced Lithography, 2013, San Jose, California, United States

Abstract

As directed self-assembly (DSA) has gained momentum over the past few years, questions about its application to high volume manufacturing have arisen. One of the major concerns is about the fundamental limits of defectivity that can be attained with the technology. If DSA applications demonstrate defectivity that rivals of traditional lithographic technologies, the pathway to the cost benefits of the technology creates a very compelling case for its large scale implementation. To address this critical question, our team at IMEC has established a process monitor flow to track the defectivity behaviors of an exemplary chemo-epitaxy application for printing line/space patterns. Through establishing this baseline, we have been able to understand both traditional lithographic defect sources in new materials as well as new classes of assembly defects associated with DSA technology. Moreover, we have explored new materials and processing to lower the level of the defectivity baseline. The robustness of the material sets and process is investigated as well. In this paper, we will report the understandings learned from the IMEC DSA process monitor flow.

Citation Download Citation

Yi Cao, YoungJun Her, Paulina Rincon Delgadillo, Nadia Vandenbroeck, Roel Gronheid, Boon Teik Chan, Yukio Hashimoto, Ainhoa Romo, Mark Somervell, Kathleen Nafus, and Paul F. Nealey "Using process monitor wafers to understand directed self-assembly defects", Proc. SPIE 8680, Alternative Lithographic Technologies V, 86801S (26 March 2013); https://doi.org/10.1117/12.2011658

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available