Paper
12 April 2013 A study on the automation of scanner matching
Author Affiliations +
Abstract
Scanner matching based on CD or patterning contours has been demonstrated in past works. All of these published works require extensive wafer metrology. In contrast, this work extends a previously proposed optical pattern matching method that requires little metrology by adding the component requirements and the procedure for creating an automation flow. In a test case, we matched an ASML XT:1900i using a DOE to an ASML NXT:1950i scanner using FlexRay. The matching was conducted on a 4x nm process test layer as a development vehicle for the 2x nm product nodes. The paper summarizes the before and after matching data and analysis, with future opportunities for improvements suggested.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yuan He, Alexander Serebryakov, Scott Light, Vivek Jain, Erik Byers, Ronald Goossens, Zhi-Yuan Niu, Peter Engblom, Scott Larson, Bernd Geh, Craig Hickman, and Hoyoung Kang "A study on the automation of scanner matching", Proc. SPIE 8683, Optical Microlithography XXVI, 86830W (12 April 2013); https://doi.org/10.1117/12.2014402
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Cited by 2 scholarly publications.
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KEYWORDS
Scanners

Semiconducting wafers

Critical dimension metrology

Wafer-level optics

Optical lithography

Cadmium

Metrology

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