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29 March 2013 Self-aligned double patterning compliant routing with in-design physical verification flow
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Abstract
Among double patterning techniques, Self-aligned double patterning (SADP) has the advantage of good mask overlay control, which has made SADP a popular double patterning method for sub-32nm technology nodes. However, SADP process places several limitations on design flexibility. This work exploits an alternative post routing approach that has the flexibility to resolve lithography violations without the overhead of repeated rule checking. In addition, it allows for successive refinement in the definition of lithographic violations as the process node matures, and implementation of fixes as localized ECO (Engineering Change Order) operations without needing to reroute the complete design.
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Jhih-Rong Gao, Harshdeep Jawandha, Prasad Atkar, Atul Walimbe, Bikram Baidya, Olivier Rizzo, and David Z. Pan "Self-aligned double patterning compliant routing with in-design physical verification flow", Proc. SPIE 8684, Design for Manufacturability through Design-Process Integration VII, 868408 (29 March 2013); https://doi.org/10.1117/12.2013245
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