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We investigated methods to extend the damage-free process window for fragile Sub-Resolution Assist Features (SRAF)
in mask cleaning using MegaSonic and binary spray techniques. Particle removal efficiency (PRE) was found to increase
by 8% and damage reduced from 7 ppm to 0 ppm with the optimization of the spray droplet characteristics through liquid
media control. MegaSonic damage was eliminated completely from 10 ppm to 0 ppm by varying physical and chemical
properties of the cleaning media. Since particles in the deep trenches are very difficult to remove using droplet spray
alone, a combination of MegaSonic and Binary Spray processes was tested. The acoustic effects generated through the
MegaSonic combined with optimized droplet impact showed an improvement of 4% in PRE of hard-to-remove trench
particles. Overall, the improved process points to a promising solution for overcoming the roadblock in mask cleaning
for the advanced mask cleaning.
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C. W. Shen, K. W. Lin, C. L. Lu, Luke Hsu, Angus Chin, Anthony Yen, "Physical force optimization for advanced photomask cleaning," Proc. SPIE 8701, Photomask and Next-Generation Lithography Mask Technology XX, 870106 (28 June 2013); https://doi.org/10.1117/12.2028484