Translator Disclaimer
28 June 2013 Physical force optimization for advanced photomask cleaning
Author Affiliations +
Proceedings Volume 8701, Photomask and Next-Generation Lithography Mask Technology XX; 870106 (2013)
Event: Photomask and NGL Mask Technology XX, 2013, Yokohama, Japan
We investigated methods to extend the damage-free process window for fragile Sub-Resolution Assist Features (SRAF) in mask cleaning using MegaSonic and binary spray techniques. Particle removal efficiency (PRE) was found to increase by 8% and damage reduced from 7 ppm to 0 ppm with the optimization of the spray droplet characteristics through liquid media control. MegaSonic damage was eliminated completely from 10 ppm to 0 ppm by varying physical and chemical properties of the cleaning media. Since particles in the deep trenches are very difficult to remove using droplet spray alone, a combination of MegaSonic and Binary Spray processes was tested. The acoustic effects generated through the MegaSonic combined with optimized droplet impact showed an improvement of 4% in PRE of hard-to-remove trench particles. Overall, the improved process points to a promising solution for overcoming the roadblock in mask cleaning for the advanced mask cleaning.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
C. W. Shen, K. W. Lin, C. L. Lu, Luke Hsu, Angus Chin, and Anthony Yen "Physical force optimization for advanced photomask cleaning", Proc. SPIE 8701, Photomask and Next-Generation Lithography Mask Technology XX, 870106 (28 June 2013);

Back to Top