Ceramic joints for pressure sensors development

Radovan Novotný; Radek Vlach; Jaroslav Kadlec; Radek Kuchta

doi:10.1117/12.2014229

17 May 2013 Ceramic joints for pressure sensors development

Radovan Novotný, Radek Vlach, Jaroslav Kadlec, Radek Kuchta

Proceedings Volume 8763, Smart Sensors, Actuators, and MEMS VI; 876309 (2013) https://doi.org/10.1117/12.2014229
Event: SPIE Microtechnologies, 2013, Grenoble, France

Abstract

This article describes the research work related to the ceramic joint quality evaluation, the thermal-structural analysis of ceramic joining and ceramic bond design and implementation. The role of ceramic material in electronics industry and motivation for joining ceramics is described in the introduction. Important directions for future research are summarized, with emphasis on the statistical determination of poor joint, and how the modification of a joint technology and process setting affects results and parameters that have been achieved. Main requirements for evaluating quality of joints are described in this paper together with the results of simulations of real ceramic joint application which is ceramic pressure sensor. During manufacturing process of this pressure sensor is one of the most critical part cooling process which was subjected to detail analysis due to number of failures and parasitic deformations revealed after removing assembled and joint pressure sensor from the oven. Our experimental results were evaluated by using the t-test before and after process cooling modification to verify their correctness.

Citation Download Citation

Radovan Novotný, Radek Vlach, Jaroslav Kadlec, and Radek Kuchta "Ceramic joints for pressure sensors development", Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 876309 (17 May 2013); https://doi.org/10.1117/12.2014229

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