Paper
17 May 2013 Control of cavitation density through gas and acoustic uniformity in a proximity megasonic pre-bond cleaning system
D. Dussault, E. Liebscher, F. Fournell, V. Dragoi
Author Affiliations +
Proceedings Volume 8763, Smart Sensors, Actuators, and MEMS VI; 87632Y (2013) https://doi.org/10.1117/12.2018006
Event: SPIE Microtechnologies, 2013, Grenoble, France
Abstract
A pre-bond cleaning process was developed utilizing a unique, radially uniform, large area proximity type Megasonic transducer. In prior work this new cleaning method was investigated for PRE (particle removal efficiency) as well as particle neutrality. These tests yielded higher values than those achieved with the processes of record. Subsequently, this process was integrated into an industrial volume low temperature fusion bonding process and enabled higher bonding yields. In the above process flow the process fluid was dispensed to fill the gap between the Megasonic transducer surface and the substrate using an atmospheric free flow stream applied to the substrate. Current work describes development, testing and operational verification of a process fluid management device used in conjunction with the wide area proximity Megasonic transducer. The goals of this development were reduction of process fluid amount required, increase the operating substrate rotation speed, and provide better control of process fluid parameters. The design criteria and process flow as well as test results demonstrating the benefits of the new system are presented.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
D. Dussault, E. Liebscher, F. Fournell, and V. Dragoi "Control of cavitation density through gas and acoustic uniformity in a proximity megasonic pre-bond cleaning system", Proc. SPIE 8763, Smart Sensors, Actuators, and MEMS VI, 87632Y (17 May 2013); https://doi.org/10.1117/12.2018006
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Cited by 2 scholarly publications.
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KEYWORDS
Particles

Semiconducting wafers

Transducers

Wafer bonding

Acoustics

Cavitation

Process control

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