Paper
22 May 2013 Semi-insulating substrate based generic InP photonic integration platform
Francisco M. Soares, Klemens Janiak, Jochen Kreissl, Martin Moehrle, Norbert Grote
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Abstract
In the European projects EuroPIC and PARADIGM development of an InP based generic photonic integration technology is being undertaken to implement complex InP based application-specific photonic integrated circuits (ASPIC) with transmit and receive functionalities from a set of basic building blocks. The integration platform pursued at Fraunhofer HHI is building on semi-insulating substrate. Recently a variety of receiver-type PIC with up to 40 GHz bandwidth capability designed by external users was fabricated in multi-project wafer runs. Examples are demonstrated. Extension of this platform to include transmit functionalities is underway using an MOVPE based butt-coupling approach.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Francisco M. Soares, Klemens Janiak, Jochen Kreissl, Martin Moehrle, and Norbert Grote "Semi-insulating substrate based generic InP photonic integration platform", Proc. SPIE 8767, Integrated Photonics: Materials, Devices, and Applications II, 87670M (22 May 2013); https://doi.org/10.1117/12.2017431
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Cited by 7 scholarly publications.
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KEYWORDS
Waveguides

Photodiodes

Photonic integrated circuits

Semiconducting wafers

Semiconductor lasers

Modulators

Signal attenuation

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