Generally in a white light-emitting diode (LED), a phosphor slurry is placed around the semiconductor chip or the phosphor is conformally coated over the chip to covert the narrowband, short-wavelength radiation to a broadband white light. Over the past few years, the remote-phosphor method has provided significant improvement in overall system efficiency by reducing the photons absorbed by the LED chip and reducing the phosphor quenching effects. However, increased light output and smaller light engine requirements are causing high radiant energy density on the remotephosphor plates, thus heating the phosphor layer. The phosphor layer temperature rise increases when the phosphor material conversion efficiency decreases. Phosphor layer heating can negatively affect performance in terms of luminous efficacy, color shift, and life. In such cases, the performance of remote-phosphor LED lighting systems can be improved by suitable thermal management to reduce the temperature of the phosphor layer. To verify this hypothesis and to understand the factors that influence the reduction in temperature, a phosphor layer was embedded in a perforated metal heatsink to remove the heat; the parameters that influence the effectiveness of heat extraction were then studied. These parameters included the heatsink-to-phosphor layer interface area and the thermal conductivity of the heatsink. The temperature of the remote-phosphor surface was measured using IR thermography. The results showed that when the heat conduction area of the heatsink increased, the phosphor layer temperature decreased, but at the same time the overall light output of the remote phosphor light engine used in this study decreased due to light absorption by the metal areas.