High-fidelity dummy fill printing with repair OPC

Louis Lin; Wei-Long Wang; Sarah McGowan

doi:10.1117/12.2022009

9 September 2013 High-fidelity dummy fill printing with repair OPC

Louis Lin, Wei-Long Wang, Sarah McGowan

Author Affiliations +

Proceedings Volume 8880, Photomask Technology 2013; 88801K (2013) https://doi.org/10.1117/12.2022009
Event: SPIE Photomask Technology, 2013, Monterey, California, United States

Abstract

Dummy fill plays a crucial role on both controlling topography uniformity and ensuring device performance by manipulating homogenous pattern density. There are several types of fill to achieve this purpose on advanced technologies. The conventional way is to place them out of optical ambit range from main features as reference for Optical Proximity Correction (OPC) procedure, but it degrades the FILL performance due to leaving considerable empty space between FILL and main features. The aggressive way is to place FILL as close as main features to perfectly achieve uniform pattern density. However, in this way, it’s challenge to produce defect-free FILL in ORC (Optical Review Check) without applying model-based OPC on FILL which boost the OPC cycle time significantly. In this paper, we propose a novel approach by in-stage Repair OPC technique to not only accurately print aggressive placement FILL on the wafer accurately but also reduce the impact of run time cost on full chip OPC processing.

Citation Download Citation

Louis Lin, Wei-Long Wang, and Sarah McGowan "High-fidelity dummy fill printing with repair OPC", Proc. SPIE 8880, Photomask Technology 2013, 88801K (9 September 2013); https://doi.org/10.1117/12.2022009

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