In-die mask registration measurement on 28nm-node and beyond

Shen Hung Chen; Yung Feng Cheng; Ming Jui Chen

doi:10.1117/12.2025462

9 September 2013 In-die mask registration measurement on 28nm-node and beyond

Shen Hung Chen, Yung Feng Cheng, Ming Jui Chen

Author Affiliations +

Proceedings Volume 8880, Photomask Technology 2013; 88801O (2013) https://doi.org/10.1117/12.2025462
Event: SPIE Photomask Technology, 2013, Monterey, California, United States

Abstract

As semiconductor go to smaller node, the critical dimension (CD) of process become more and more small. For lithography, RET (Resolution Enhancement Technology) applications can be used for wafer printing of smaller CD/pitch on 28nm node and beyond. SMO (Source Mask Optimization), DPT (Double Patterning Technology) and SADP (Self-Align Double Patterning) can provide lower k1 value for lithography. In another way, image placement error and overlay control also become more and more important for smaller chip size (advanced node). Mask registration (image placement error) and mask overlay are important factors to affect wafer overlay control/performance especially for DPT or SADP. In traditional method, the designed registration marks (cross type, square type) with larger CD were put into scribe-line of mask frame for registration and overlay measurement. However, these patterns are far way from real patterns. It does not show the registration of real pattern directly and is not a convincing method. In this study, the in-die (in-chip) registration measurement is introduced. We extract the dummy patterns that are close to main pattern from post-OPC (Optical Proximity Correction) gds by our desired rule and choose the patterns that distribute over whole mask uniformly. The convergence test shows 100 points measurement has a reliable result.

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Shen Hung Chen, Yung Feng Cheng, and Ming Jui Chen "In-die mask registration measurement on 28nm-node and beyond", Proc. SPIE 8880, Photomask Technology 2013, 88801O (9 September 2013); https://doi.org/10.1117/12.2025462

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KEYWORDS

Image registration

Photomasks

Semiconducting wafers

Diffusion

Critical dimension metrology

Overlay metrology

Line width roughness

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