Paper
25 July 2013 Low-resistance contact layers on the basis of polymer composites containing silver nanoparticles dedicated to semiconductor devices
Joanna Kalbarczyk, Anna Młożniak, Konrad Krzyżak, Marian Teodorczyk
Author Affiliations +
Proceedings Volume 8902, Electron Technology Conference 2013; 89022K (2013) https://doi.org/10.1117/12.2031179
Event: Electron Technology Conference 2013, 2013, Ryn, Poland
Abstract
Manufacturing of semiconductor devices consists of many equally significant stages. Every improperly-performed detail may cause abnormal functioning of the device which is very undesirable. Electrical contact manufacturing guarantees the connection between the "inner world" containing phenomena on the molecular level of the device and the "outer world" including connections to other objects and enabling consumer usability. In the following thesis two kinds of pastes containing silver nanoparticles in polymer matrix have been used to make electrical contacts. Performed layers have been compared with sputtering-method made contacts.
© (2013) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joanna Kalbarczyk, Anna Młożniak, Konrad Krzyżak, and Marian Teodorczyk "Low-resistance contact layers on the basis of polymer composites containing silver nanoparticles dedicated to semiconductor devices", Proc. SPIE 8902, Electron Technology Conference 2013, 89022K (25 July 2013); https://doi.org/10.1117/12.2031179
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Silver

Resistance

Annealing

Nanoparticles

Semiconductors

Polymers

Silicon

Back to Top