Wafer-fused VECSELs emitting in the 1310nm  waveband

A. Sirbu; K. Pierscinski; A. Mereuta; V. Iakovlev; A. Caliman; Z. Micovic; N. Volet; J. Rautiainen; J. Heikkinen; J. Lyytikainen; A. Rantamäki; O. Okhotnikov; E. Kapon

doi:10.1117/12.2039692

3 March 2014 Wafer-fused VECSELs emitting in the 1310nm waveband

A. Sirbu, K. Pierscinski, A. Mereuta, V. Iakovlev, A. Caliman, Z. Micovic, N. Volet, J. Rautiainen, J. Heikkinen, J. Lyytikainen, A. Rantamäki, O. Okhotnikov, E. Kapon

Author Affiliations +

Proceedings Volume 8966, Vertical External Cavity Surface Emitting Lasers (VECSELs) IV; 89660G (2014) https://doi.org/10.1117/12.2039692
Event: SPIE LASE, 2014, San Francisco, California, United States

Abstract

Optically pumped wafer fused 1310 nm VECSELs have the advantage of high output power and wavelength agility. Gain mirrors in these lasers are formed by direct bonding of InAlGaAs/InP active cavities to Al(Ga)As/GaAs DBRs. We present for the first time Watt-level 1310 nm wafer-fused VCSELs based on gain mirrors with heat dissipation in the “flip-chip” configuration. Even though output power levels in this approach is lower than with intra-cavity diamond heat-spreaders, the “flip-chip configuration demonstrates higher quality optical emission and is preferable for industrial applications in optical amplifiers, intra-cavity doubled lasers, etc.

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A. Sirbu, K. Pierscinski, A. Mereuta, V. Iakovlev, A. Caliman, Z. Micovic, N. Volet, J. Rautiainen, J. Heikkinen, J. Lyytikainen, A. Rantamäki, O. Okhotnikov, and E. Kapon "Wafer-fused VECSELs emitting in the 1310nm waveband", Proc. SPIE 8966, Vertical External Cavity Surface Emitting Lasers (VECSELs) IV, 89660G (3 March 2014); https://doi.org/10.1117/12.2039692

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