Heterogeneous MEMS device assembly and integration

Patrice Topart; Francis Picard; Samir Ilias; Christine Alain; Claude Chevalier; Bruno Fisette; Jacques E. Paultre; Francis Généreux; Mathieu Legros; Jean-François Lepage; Christian Laverdière; Linh Ngo Phong; Jean-Sol Caron; Yan Desroches

doi:10.1117/12.2041576

7 March 2014 Heterogeneous MEMS device assembly and integration

Patrice Topart, Francis Picard, Samir Ilias, Christine Alain, Claude Chevalier, Bruno Fisette, Jacques E. Paultre, Francis Généreux, Mathieu Legros, Jean-François Lepage, Christian Laverdière, Linh Ngo Phong, Jean-Sol Caron, Yan Desroches

Author Affiliations +

Proceedings Volume 8975, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII; 89750E (2014) https://doi.org/10.1117/12.2041576
Event: SPIE MOEMS-MEMS, 2014, San Francisco, California, United States

Abstract

In recent years, smart phone applications have both raised the pressure for cost and time to market reduction, and the need for high performance MEMS devices. This trend has led the MEMS community to develop multi-die packaging of different functionalities or multi-technology (i.e. wafer) approaches to fabricate and assemble devices respectively. This paper reports on the fabrication, assembly and packaging at INO of various MEMS devices using heterogeneous assembly at chip and package-level. First, the performance of a giant (e.g. about 3 mm in diameter), electrostatically actuated beam steering mirror is presented. It can be rotated about two perpendicular axes to steer an optical beam within an angular cone of up to 60° in vector scan mode with an angular resolution of 1 mrad and a response time of 300 ms. To achieve such angular performance relative to mirror size, the microassembly was performed from sub-components fabricated from 4 different wafers. To combine infrared detection with inertial sensing, an electroplated proof mass was flip-chipped onto a 256×1 pixel uncooled bolometric FPA and released using laser ablation. In addition to the microassembly technology, performance results of packaged devices are presented. Finally, to simulate a 3072×3 pixel uncooled detector for cloud and fire imaging in mid and long-wave IR, the staggered assembly of six 512×3 pixel FPAs with a less than 50 micron pixel co-registration is reported.

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Patrice Topart, Francis Picard, Samir Ilias, Christine Alain, Claude Chevalier, Bruno Fisette, Jacques E. Paultre, Francis Généreux, Mathieu Legros, Jean-François Lepage, Christian Laverdière, Linh Ngo Phong, Jean-Sol Caron, and Yan Desroches "Heterogeneous MEMS device assembly and integration", Proc. SPIE 8975, Reliability, Packaging, Testing, and Characterization of MOEMS/MEMS, Nanodevices, and Nanomaterials XIII, 89750E (7 March 2014); https://doi.org/10.1117/12.2041576

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KEYWORDS

Mirrors

Bolometers

Electrodes

Microelectromechanical systems

Semiconducting wafers

Sensors

Dysprosium

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