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19 February 2014 Advances in silicon photonics WDM devices
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System performance scaling imposes an increase of package-to-package aggregate bandwidths to interface chips in high performance computing. This scaling is expected to encounter several I/O bottlenecks (pin count, speed, power consumption) when implemented in the electrical domain. Several optical interface technologies are being proposed among which silicon photonics, considered as a promising candidate. In this paper we will review the recent progress made in this technology that may enable multi-channel WDM links for package-to-package interconnects: 1.0V drivers with microring modulators and compact manufacturable microring filters with efficient thermal tuning.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Philippe P. Absil, Peter De Heyn, Pieter Dumon, Dries Van Thourhout, Peter Verheyen, Shankar Selvaraja, Guy Lepage, Marianna Pantouvaki, Michal Rakowski, and Joris Van Campenhout "Advances in silicon photonics WDM devices", Proc. SPIE 9010, Next-Generation Optical Networks for Data Centers and Short-Reach Links, 90100J (19 February 2014);


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