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6 March 2014 Low-cost structured-light based 3D capture system design
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Proceedings Volume 9013, Three-Dimensional Image Processing, Measurement (3DIPM), and Applications 2014; 90130B (2014)
Event: IS&T/SPIE Electronic Imaging, 2014, San Francisco, California, United States
Most of the 3D capture products currently in the market are high-end and pricey. They are not targeted for consumers, but rather for research, medical, or industrial usage. Very few aim to provide a solution for home and small business applications. Our goal is to fill in this gap by only using low-cost components to build a 3D capture system that can satisfy the needs of this market segment. In this paper, we present a low-cost 3D capture system based on the structured-light method. The system is built around the HP TopShot LaserJet Pro M275. For our capture device, we use the 8.0 Mpixel camera that is part of the M275. We augment this hardware with two 3M MPro 150 VGA (640 × 480) pocket projectors. We also describe an analytical approach to predicting the achievable resolution of the reconstructed 3D object based on differentials and small signal theory, and an experimental procedure for validating that the system under test meets the specifications for reconstructed object resolution that are predicted by our analytical model. By comparing our experimental measurements from the camera-projector system with the simulation results based on the model for this system, we conclude that our prototype system has been correctly configured and calibrated. We also conclude that with the analytical models, we have an effective means for specifying system parameters to achieve a given target resolution for the reconstructed object.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Jing Dong, Kurt R. Bengtson, Barrett F. Robinson, and Jan P. Allebach "Low-cost structured-light based 3D capture system design", Proc. SPIE 9013, Three-Dimensional Image Processing, Measurement (3DIPM), and Applications 2014, 90130B (6 March 2014);

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