Novel surface treatment materials for aligning block-co-polymer in directed self-assembly processes

Yasunobu Someya; Hiroyuki Wakayama; Takafumi Endo; Rikimaru Sakamoto

doi:10.1117/12.2046271

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27 March 2014 Novel surface treatment materials for aligning block-co-polymer in directed self-assembly processes

Yasunobu Someya, Hiroyuki Wakayama, Takafumi Endo, Rikimaru Sakamoto

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Proceedings Volume 9051, Advances in Patterning Materials and Processes XXXI; 90510L (2014) https://doi.org/10.1117/12.2046271
Event: SPIE Advanced Lithography, 2014, San Jose, California, United States

Abstract

Directed Self-Assembly (DSA) process is one of the attractive processes for creating the very fine pitch pattern. Especially, the contact hole shrink processes with block-co-polymer (BCP) or polymer blend materials were attractive processes for creating very small size hole patterns with better CD uniformity compare to general photo-lithography patterning. In general contact hole shrink process, the pattern of Spin-on Carbon Hardmask (SOC) or the photo Resist pattern created by Negative-Tone Development (NTD) process were selected for guide patterns. Since the alignment property of BCP was affected by the surface of these guide materials, it is important to control the surface condition of guide in order to obtain good shrunk contact hole patterns. In this study, we will report the surface treatment materials to control the surface condition of guide patterns such as SOC or NTD resist to achieve the better contact hole shrink performance. These materials were attached to guide pattern surface and controlled the surface energy.

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Yasunobu Someya, Hiroyuki Wakayama, Takafumi Endo, and Rikimaru Sakamoto "Novel surface treatment materials for aligning block-co-polymer in directed self-assembly processes", Proc. SPIE 9051, Advances in Patterning Materials and Processes XXXI, 90510L (27 March 2014); https://doi.org/10.1117/12.2046271

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