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22 April 2014 Front Matter: Volume 9053
Abstract
This PDF file contains the front matter associated with SPIE Proceedings Volume 9053 including the Title Page, Copyright information, Table of Contents, Introduction, and Conference Committee listing.

The papers included in this volume were part of the technical conference cited on the cover and title page. Papers were selected and subject to review by the editors and conference program committee. Some conference presentations may not be available for publication. The papers published in these proceedings reflect the work and thoughts of the authors and are published herein as submitted. The publisher is not responsible for the validity of the information or for any outcomes resulting from reliance thereon.

Please use the following format to cite material from this book:

Author(s), “Title of Paper,” in Design-Process-Technology Co-optimization for Manufacturability VIII, edited by John L. Sturtevant, Luigi Capodieci, Proceedings of SPIE Vol. 9053 (SPIE, Bellingham, WA, 2014) Article CID Number.

ISSN: 0277-786X

ISBN: 9780819499769

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Paper Numbering: Proceedings of SPIE follow an e-First publication model, with papers published first online and then in print and on CD-ROM. Papers are published as they are submitted and meet publication criteria. A unique, consistent, permanent citation identifier (CID) number is assigned to each article at the time of the first publication. Utilization of CDs allows articles to be fully citable as soon as they are published online, and connects the same identifier to all online, print, and electronic versions of the publication. SPIE uses a six-digit CID article numbering system in which:

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Conference Committee

Symposium Chair

  • Harry J. Levinson, GLOBALFOUNDRIES, Inc. (United States)

Symposium Co-chair

  • Mircea V. Dusa, ASML US, Inc. (United States)

Conference Chair

  • John L. Sturtevant, Mentor Graphics Corp. (United States)

Conference Co-chair

  • Luigi Capodieci, GLOBALFOUNDRIES Inc. (United States)

Conference Program Committee

  • Robert Aitken, ARM Inc. (United States)

  • Jason P. Cain, Advanced Micro Devices, Inc. (United States)

  • Fang-Cheng Chang, Cadence Design Systems, Inc. (United States)

  • Lars W. Liebmann, IBM Corporation (United States)

  • Mark E. Mason, Texas Instruments Inc. (United States)

  • Andrew R. Neureuther, University of California, Berkeley (United States)

  • David Z. Pan, The University of Texas at Austin (United States)

  • Chul-Hong Park, SAMSUNG Electronics Company, Ltd. (Korea, Republic of)

  • Michael L. Rieger, Synopsys, Inc. (United States)

  • Vivek K. Singh, Intel Corporation (United States)

  • Chi-Min Yuan, Freescale Semiconductor, Inc. (United States)

Session Chairs

  • 1 Patterns in DTCO

    • John Sturtevant, Mentor Graphics Corporation (United States)

    • Luigi Capodieci, GLOBALFOUNDRIES Inc. (United States)

  • 2 Multipatterning

    • Robert Aitken, ARM Inc. (United States)

    • Vivek K. Singh, Intel Corporation (United States)

  • 3 Hotspots

    • Lars W. Liebmann, IBM Corporation (United States)

    • Jason P. Cain, Advanced Micro Devices, Inc. (United States)

  • 4 Design Optimization I

    • Michael L. Rieger, Synopsys, Inc. (United States)

    • David Z. Pan, The University of Texas at Austin (United States)

  • 5 Pattern-Aware Techniques: Joint Session with Conferences 9052 and 9053

    • Luigi Capodieci, GLOBALFOUNDRIES Inc. (United States)

    • Jongwook Kye, GLOBALFOUNDRIES Inc. (United States)

  • 6 Design Optimization II

    • Chi-Min Yuan, Freescale Semiconductor, Inc. (United States)

    • Luigi Capodieci, GLOBALFOUNDRIES Inc. (United States)

  • 7 DSA Design for Manufacturability: Joint Session with Conferences 9049, 9052, and 9053

    • Michael A. Guillorn, IBM Thomas J. Watson Research Center (United States)

    • Bruce W. Smith, Rochester Institute of Technology (United States)

  • 8 Design Optimization III

    • Andrew R. Neureuther, University of California, Berkeley (United States)

    • Fang-Cheng Chang, Cadence Design Systems, Inc. (United States)

© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
"Front Matter: Volume 9053", Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 905301 (22 April 2014); https://doi.org/10.1117/12.2064480
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KEYWORDS
Visualization

Lithography

Optimization (mathematics)

Design for manufacturability

Manufacturing

Optical lithography

Signal processing

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