Translator Disclaimer
28 March 2014 Technology-design-manufacturing co-optimization for advanced mobile SoCs
Author Affiliations +
How to maintain the Moore’s Law scaling beyond the 193 immersion resolution limit is the key question semiconductor industry needs to answer in the near future. Process complexity will undoubtfully increase for 14nm node and beyond, which brings both challenges and opportunities for technology development. A vertically integrated design-technologymanufacturing co-optimization flow is desired to better address the complicated issues new process changes bring. In recent years smart mobile wireless devices have been the fastest growing consumer electronics market. Advanced mobile devices such as smartphones are complex systems with the overriding objective of providing the best userexperience value by harnessing all the technology innovations. Most critical system drivers are better system performance/power efficiency, cost effectiveness, and smaller form factors, which, in turns, drive the need of system design and solution with More-than-Moore innovations. Mobile system-on-chips (SoCs) has become the leading driver for semiconductor technology definition and manufacturing. Here we highlight how the co-optimization strategy influenced architecture, device/circuit, process technology and package, in the face of growing process cost/complexity and variability as well as design rule restrictions.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Da Yang, Chock Gan, P. R. Chidambaram, Giri Nallapadi, John Zhu, S. C. Song, Jeff Xu, and Geoffrey Yeap "Technology-design-manufacturing co-optimization for advanced mobile SoCs", Proc. SPIE 9053, Design-Process-Technology Co-optimization for Manufacturability VIII, 90530N (28 March 2014);


Back to Top