Ultrasonic guided wave sensing properties of PVDF thin film with inter digital electrodes

Vivek T. Rathod; D. Roy Mahapatra

doi:10.1117/12.2047314

10 April 2014 Ultrasonic guided wave sensing properties of PVDF thin film with inter digital electrodes

Vivek T. Rathod, D. Roy Mahapatra

Proceedings Volume 9062, Smart Sensor Phenomena, Technology, Networks, and Systems Integration 2014; 90620U (2014) https://doi.org/10.1117/12.2047314
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2014, San Diego, California, United States

Abstract

Ultrasonic strain sensing performance of the large area PVDF with Inter Digital Electrodes (IDE) is studied in this work. Procedure to obtain IDE on a beta-phase PVDF is explained. PVDF film with IDE is bonded on a plate structure and is characterized for its directional sensitivity at different frequencies. Guided waves are induced on the IDE-PVDF sensor from different directions by placing a piezoelectric wafer actuator at different angles. Strain induced on the IDE-PVDF sensor by the guided waves in estimated by using a Laser Doppler Vibrometer (LDV) and a wave propagation model. Using measured voltage response from IDE-PVDF sensor and the strain measurements from LDV the piezoelectric coefficient is estimated in various directions. The variation of ℯ11 e at different angles shows directional sensitivity of the IDE-PVDF sensor to the incident guided waves. The present study provides an effective technique to characterize thin film piezoelectric sensors for ultrasonic strain sensing at very high frequencies of 200 kHz. Often frequency of the guided wave is changed to alter the wavelength to interrogate damages of different sizes in Structural Health Monitoring (SHM) applications. The unique property of directional sensitivity combined with frequency tunability makes the IDEPVDF sensor most suitable for SHM of structures.

Citation Download Citation

Vivek T. Rathod and D. Roy Mahapatra "Ultrasonic guided wave sensing properties of PVDF thin film with inter digital electrodes", Proc. SPIE 9062, Smart Sensor Phenomena, Technology, Networks, and Systems Integration 2014, 90620U (10 April 2014); https://doi.org/10.1117/12.2047314

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