Monitoring of acoustic emission activity using thin wafer piezoelectric sensors

Blaine Trujillo; Andrei Zagrai; Daniel Meisner; Sepand Momeni

doi:10.1117/12.2047979

28 March 2014 Monitoring of acoustic emission activity using thin wafer piezoelectric sensors

Blaine Trujillo, Andrei Zagrai, Daniel Meisner, Sepand Momeni

Proceedings Volume 9064, Health Monitoring of Structural and Biological Systems 2014; 906418 (2014) https://doi.org/10.1117/12.2047979
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2014, San Diego, California, United States

Abstract

Acoustic emission (AE) is a well-known technique for monitoring onset and propagation of material damage. The technique has demonstrated utility in assessment of metallic and composite materials in applications ranging from civil structures to aerospace vehicles. While over the course of few decades AE hardware has changed dramatically with the sensors experiencing little changes. A traditional acoustic emission sensor solution utilizes a thickness resonance of the internal piezoelectric element which, coupled with internal amplification circuit, results in relatively large sensor footprint. Thin wafer piezoelectric sensors are small and unobtrusive, but they have seen limited AE applications due to low signal-to-noise ratio and other operation difficulties. In this contribution, issues and possible solutions pertaining to the utility of thin wafer piezoelectrics as AE sensors are discussed. Results of AE monitoring of fatigue damage using thin wafer piezoelectric and conventional AE sensors are presented.

Citation Download Citation

Blaine Trujillo, Andrei Zagrai, Daniel Meisner, and Sepand Momeni "Monitoring of acoustic emission activity using thin wafer piezoelectric sensors", Proc. SPIE 9064, Health Monitoring of Structural and Biological Systems 2014, 906418 (28 March 2014); https://doi.org/10.1117/12.2047979

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