Paper
29 May 2014 Scalable emitter array development for infrared scene projector systems
Author Affiliations +
Abstract
Several new technologies have been developed over recent years that make a fundamental change in the scene projection for infrared hardware in the loop test. Namely many of the innovations are in Read In Integrated Circuit (RIIC) architecture, which can lead to an operational and cost effective solution for producing large emitter arrays based on the assembly of smaller sub-arrays. Array sizes of 2048x2048 and larger are required to meet the high fidelity test needs of today’s modern infrared sensors. The Test Resource Management Center (TRMC) Test and Evaluation/Science and Technology (T and E/S and T) Program through the U.S. Army Program Executive Office for Simulation, Training and Instrumentations (PEO STRI) has contracted with SBIR and its partners to investigate integrating new technologies in order to achieve array sizes much larger than are available today. SBIR and its partners have undertaken several proof-of-concept experiments that provide the groundwork for producing a tiled emitter array. Herein we will report on the results of these experiments, including the demonstration of edge connections formed between different ICs with a gap of less than 10µm.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Kevin Sparkman, Joe LaVeigne, Steve McHugh, Jason Kulick, John Lannon, and Scott Goodwin "Scalable emitter array development for infrared scene projector systems", Proc. SPIE 9071, Infrared Imaging Systems: Design, Analysis, Modeling, and Testing XXV, 90711I (29 May 2014); https://doi.org/10.1117/12.2054360
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Cited by 6 scholarly publications.
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KEYWORDS
Packaging

Infrared radiation

Silicon

Projection systems

Semiconducting wafers

Infrared imaging

Integrated circuits

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