Wideband 220 GHz solid state power amplifier MMIC within minimal die size

Jerome Cheron; Erich N. Grossman

doi:10.1117/12.2050744

21 May 2014 Wideband 220 GHz solid state power amplifier MMIC within minimal die size

Jerome Cheron, Erich N. Grossman

Proceedings Volume 9102, Terahertz Physics, Devices, and Systems VIII: Advanced Applications in Industry and Defense; 91020H (2014) https://doi.org/10.1117/12.2050744
Event: SPIE Sensing Technology + Applications, 2014, Baltimore, MD, United States

Abstract

A wideband and compact solid state power amplifier MMIC is simulated around 220 GHz. It utilizes 6 μm emitter length common base HBTs from a 250 nm InP HBT technology. Specific power cells and power combiners are simulated in order to minimize the width of the die, which must not exceed 300 μm to avoid multimode propagation in the substrate. Four stages are implemented over a total area of the (275x1840) μm². Simulations of this power amplifier indicate a minimum output power of 14 dBm associated with 16 dB of power gain from 213 GHz to 240 GHz.

Citation Download Citation

Jerome Cheron and Erich N. Grossman "Wideband 220 GHz solid state power amplifier MMIC within minimal die size", Proc. SPIE 9102, Terahertz Physics, Devices, and Systems VIII: Advanced Applications in Industry and Defense, 91020H (21 May 2014); https://doi.org/10.1117/12.2050744

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