Modern applications in biomedical imaging, machine vision and security engineering require close-up optical systems with high resolution. Combined with the need for miniaturization and fast image acquisition of extended object fields, the design and fabrication of respective devices is extremely challenging. Standard commercial imaging solutions rely on bulky setups or depend on scanning techniques in order to meet the stringent requirements. Recently, our group has proposed a novel, multi-aperture approach based on parallel image transfer in order to overcome these constraints. It exploits state of the art microoptical manufacturing techniques on wafer level in order to create a compact, cost-effective system with a large field of view. However, initial prototypes have so far been subject to various limitations regarding their manufacturing, reliability and applicability. In this work, we demonstrate the optical design and fabrication of an advanced system, which overcomes these restrictions. In particular, a revised optical design facilitates a more efficient and economical fabrication process and inherently improves system reliability. An additional customized front side illumination module provides homogeneous white light illumination over the entire field of view while maintaining a high degree of compactness. Moreover, the complete imaging assembly is mounted on a positioning system. In combination with an extended working range, this allows for adjustment of the system’s focus location. The final optical design is capable of capturing an object field of 36x24 mm2 with a resolution of 150 cycles/mm. Finally, we present experimental results of the respective prototype that demonstrate its enhanced capabilities.