Paper
17 October 2014 Contact hole multiplication using grapho-epitaxy directed self-assembly: process choices, template optimization, and placement accuracy
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Proceedings Volume 9231, 30th European Mask and Lithography Conference; 92310R (2014) https://doi.org/10.1117/12.2066647
Event: 30th European Mask and Lithography Conference, 2014, Dresden, Germany
Abstract
Directed Self Assembly (DSA) of Block Co-Polymers (BCP) has become an intense field of study as a potential patterning solution for future generation devices. The most critical challenges that need to be understood and controlled include pattern placement accuracy, achieving low defectivity in DSA patterns and how to implement this process as a patterning solution. The DSA program at imec includes efforts on these three major topics. Specifically, in this paper the progress for the templated DSA flow within the imec program will be discussed. An experimental assessment is made based on a 37 nm BCP pitch material. In particular, the impact of different process options is illustrated, and data for CD and placement accuracy of the DSA holes in their template is provided.
© (2014) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Joost Bekaert, Jan Doise, Vijaya-Kumar Murugesan Kuppuswamy, Roel Gronheid, Boon Teik Chan, Geert Vandenberghe, Yi Cao, and YoungJun Her "Contact hole multiplication using grapho-epitaxy directed self-assembly: process choices, template optimization, and placement accuracy", Proc. SPIE 9231, 30th European Mask and Lithography Conference, 92310R (17 October 2014); https://doi.org/10.1117/12.2066647
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Cited by 8 scholarly publications.
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KEYWORDS
Directed self assembly

Critical dimension metrology

Transmission electron microscopy

Optical lithography

System on a chip

Cadmium

Etching

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