Short feedback loop for OPC model based on wafer level CD

Guoxiang Ning; Thomas Thaler; Kristian Schulz; Peter Philipp; Ute Buttgereit; Paul Ackmann; Lloyd C. Litt; Chin Teong Lim

doi:10.1117/12.2066169

29 October 2014 Short feedback loop for OPC model based on wafer level CD

Guoxiang Ning, Thomas Thaler, Kristian Schulz, Peter Philipp, Ute Buttgereit, Paul Ackmann, Lloyd C. Litt, Chin Teong Lim

Author Affiliations +

Proceedings Volume 9235, Photomask Technology 2014; 92351U (2014) https://doi.org/10.1117/12.2066169
Event: SPIE Photomask Technology, 2014, Monterey, California, United States

Abstract

A calibrated Optical Proximity Correction Model (OPC) allows the accurate prediction of wafer printing results based on the geometrically defined layout of features. Therefore the OPC Model takes physical parameter of the mask, optical parameter of the printing system and chemical parameter of the resist into account. In order to find a good correlation between OPC simulated data and real wafer prints, the mentioned parameter needs to be calibrated. In the past, this calibration was done based only on the wafer CD SEM measurements. To speed up the calibration process, this paper investigates the possibility to use the aerial image measured by a wafer level critical dimension measurement tool (WLCD) to shorten the feedback loop and to reduce the amount of wafer prints needed for calibration.

Citation Download Citation

Guoxiang Ning, Thomas Thaler, Kristian Schulz, Peter Philipp, Ute Buttgereit, Paul Ackmann, Lloyd C. Litt, and Chin Teong Lim "Short feedback loop for OPC model based on wafer level CD", Proc. SPIE 9235, Photomask Technology 2014, 92351U (29 October 2014); https://doi.org/10.1117/12.2066169

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