You have requested a machine translation of selected content from our databases. This functionality is provided solely for your convenience and is in no way intended to replace human translation. Neither SPIE nor the owners and publishers of the content make, and they explicitly disclaim, any express or implied representations or warranties of any kind, including, without limitation, representations and warranties as to the functionality of the translation feature or the accuracy or completeness of the translations.
Translations are not retained in our system. Your use of this feature and the translations is subject to all use restrictions contained in the Terms and Conditions of Use of the SPIE website.
24 October 2014Electro-optical line cards with multimode polymer waveguides for chip-to-chip interconnects
In this paper, we report developments of electro-optical PCBs (EO-PCB) with low-loss (<0.05dB/cm) polymer
waveguides. Our results shows successful fabrication of complex waveguide structures part of hybrid EO-PCBs utilizing
production scale process on standard board panels. Test patterns include 90° bends of varying radii (40mm – 2mm),
waveguide crossing with varied crossing angles (90°-20°), cascaded bends with varying radii, splitters and tapered
waveguides. Full ranges of geometric configurations are required to meet practical optical routing functions and layouts.
Moreover, we report results obtained to realize structures to integrate optical connectors with waveguides. Experimental
results are shown for MT in-plane and 90° out-of-plane optical connectors realized with coupling loss < 2dB and < 2.5
dB, respectively. These connectors are crucial to realize efficient light coupling from/to TX/RX chip-to-waveguide and
within waveguide-to-fiber connections in practical optical PCBs. Furthermore, we show results for fabricating electrical
interconnect structures e.g. tracing layers, vias, plated vias top/bottom and through optical layers. Process compatibility
with accepted practices and production scale up for high volumes are key concerns to meet the yield target and cost
efficiency. Results include waveguide characterization, transmission loss, misalignment tolerance, and effect of
lamination. Critical link metrics are reported.
The alert did not successfully save. Please try again later.
Long Xiu Zhu, Marika Immonen, Jinhua Wu, Hui Juan Yan, Ruizhi Shi, Peifeng Chen, Tarja Rapala-Virtanen, "Electro-optical line cards with multimode polymer waveguides for chip-to-chip interconnects," Proc. SPIE 9270, Optoelectronic Devices and Integration V, 92700C (24 October 2014); https://doi.org/10.1117/12.2071965