Design of the small pixel pitch ROIC

Qinghua Liang; Dazhao Jiang; Honglei Chen; Yongcheng Zhai; Lei Gao; Ruijun Ding

doi:10.1117/12.2071379

11 November 2014 Design of the small pixel pitch ROIC

Qinghua Liang, Dazhao Jiang, Honglei Chen, Yongcheng Zhai, Lei Gao, Ruijun Ding

Proceedings Volume 9275, Infrared, Millimeter-Wave, and Terahertz Technologies III; 92750V (2014) https://doi.org/10.1117/12.2071379
Event: SPIE/COS Photonics Asia, 2014, Beijing, China

Abstract

Since the technology trend of the third generation IRFPA towards resolution enhancing has steadily progressed,the pixel pitch of IRFPA has been greatly reduced.A 640×512 readout integrated circuit(ROIC) of IRFPA with 15μm pixel pitch is presented in this paper.The 15μm pixel pitch ROIC design will face many challenges.As we all known,the integrating capacitor is a key performance parameter when considering pixel area,charge capacity and dynamic range,so we adopt the effective method of 2 by 2 pixels sharing an integrating capacitor to solve this problem.The input unit cell architecture will contain two paralleled sample and hold parts,which not only allow the FPA to be operated in full frame snapshot mode but also save relatively unit circuit area.Different applications need more matching input unit circuits. Because the dimension of 2×2 pixels is 30μm×30μm, an input stage based on direct injection (DI) which has medium injection ratio and small layout area is proved to be suitable for middle wave (MW) while BDI with three-transistor cascode amplifier for long wave(LW). By adopting the 0.35μm 2P4M mixed signal process, the circuit architecture can make the effective charge capacity of 7.8Me^- per pixel with 2.2V output range for MW and 7.3 Me^- per pixel with 2.6V output range for LW. According to the simulation results, this circuit works well under 5V power supply and achieves less than 0.1% nonlinearity.

Citation Download Citation

Qinghua Liang, Dazhao Jiang, Honglei Chen, Yongcheng Zhai, Lei Gao, and Ruijun Ding "Design of the small pixel pitch ROIC", Proc. SPIE 9275, Infrared, Millimeter-Wave, and Terahertz Technologies III, 92750V (11 November 2014); https://doi.org/10.1117/12.2071379

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KEYWORDS

Signal processing

Amplifiers

Capacitors

Readout integrated circuits

Medium wave

Sensors

Transistors

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