A CWDM photoreceiver module for 10 Gb/s x 4ch interconnection based on a vertical-illumination-type Ge-on-Si photodetectors and a silica-based AWG

Ki-Seok Jang; Jiho Joo; Taeyong Kim; Sanghoon Kim; Jin Hyuk Oh; In Gyoo Kim; Sun Ae Kim; Gyungock Kim

doi:10.1117/12.2078844

3 April 2015 A CWDM photoreceiver module for 10 Gb/s x 4ch interconnection based on a vertical-illumination-type Ge-on-Si photodetectors and a silica-based AWG

Ki-Seok Jang, Jiho Joo, Taeyong Kim, Sanghoon Kim, Jin Hyuk Oh, In Gyoo Kim, Sun Ae Kim, Gyungock Kim

Author Affiliations +

Proceedings Volume 9368, Optical Interconnects XV; 93680C (2015) https://doi.org/10.1117/12.2078844
Event: SPIE OPTO, 2015, San Francisco, California, United States

Abstract

We report a 40 Gb/s photoreceiver based on vertical-illumination type Ge-on-Si photodetectors and a silica-based AWG demultiplexer by employing 4-channel CWDM. The 60um-diameter Ge-on-Si photodetector arrays, grown on a bulk silicon wafer by RPCVD and fabricated with CMOS-compatible process, have ~0.9 A/W responsivity with 13 GHz bandwidth at λ ~ 1330nm. Ge-on-Si photodetector arrays are hybrid-integrated with TIA/LAs and directly-coupled to the AWG. The low-cost FPCB-package based photoreceiver module shows 10.3 Gb/s × 4-channel interconnection with -11 ~ -12.2 dBm sensitivity at a BER = 10^-12.

Citation Download Citation

Ki-Seok Jang, Jiho Joo, Taeyong Kim, Sanghoon Kim, Jin Hyuk Oh, In Gyoo Kim, Sun Ae Kim, and Gyungock Kim "A CWDM photoreceiver module for 10 Gb/s x 4ch interconnection based on a vertical-illumination-type Ge-on-Si photodetectors and a silica-based AWG", Proc. SPIE 9368, Optical Interconnects XV, 93680C (3 April 2015); https://doi.org/10.1117/12.2078844

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