Paper
19 March 2015 Hybridization of XRF/XPS and scatterometry for Cu CMP process control
Benoit L'Herron, Robin Chao, Kwanghoon Kim, Wei Ti Lee, Koichi Motoyama, Bartlet Deprospo, Theodorus Standaert, John Gaudiello, Cindy Goldberg
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Abstract
This paper demonstrates the synergy between X-rays techniques and scatterometry, and the benefits to combine the data to improve the accuracy and precision for in-line metrology. Particular example is given to show that the hybridization addresses the challenges of aggressive patterning. In 10nm node back-end-of-line (BEOL) integration, we show that the hybridized data between scatterometry and simultaneous X-Ray Fluorescence (XRF) and X-ray Photoelectron Spectroscopy (XPS) provided the closest dimensional correlation to TEM results compared to the individual technique and CDSEM.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Benoit L'Herron, Robin Chao, Kwanghoon Kim, Wei Ti Lee, Koichi Motoyama, Bartlet Deprospo, Theodorus Standaert, John Gaudiello, and Cindy Goldberg "Hybridization of XRF/XPS and scatterometry for Cu CMP process control", Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94241M (19 March 2015); https://doi.org/10.1117/12.2086155
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KEYWORDS
Copper

Scatterometry

Metrology

Chemical mechanical planarization

Critical dimension metrology

X-rays

Semiconducting wafers

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