The use of eDR-71xx for DSA defect review and automated classification

Hari Pathangi; Dieter Van Den Heuvel; Hareen Bayana; Loemba Bouckou; Jim Brown; Paolo Parisi; Rohan Gosain

doi:10.1117/12.2085902

19 March 2015 The use of eDR-71xx for DSA defect review and automated classification

Hari Pathangi, Dieter Van Den Heuvel, Hareen Bayana, Loemba Bouckou, Jim Brown, Paolo Parisi, Rohan Gosain

Proceedings Volume 9424, Metrology, Inspection, and Process Control for Microlithography XXIX; 94242F (2015) https://doi.org/10.1117/12.2085902
Event: SPIE Advanced Lithography, 2015, San Jose, California, United States

Abstract

The Liu-Nealey (LiNe) chemo-epitaxy Directed Self Assembly flow has been screened thoroughly in the past years in terms of defects. Various types of DSA specific defects have been identified and best known methods have been developed to be able to get sufficient S/N for defect inspection to help understand the root causes for the various defect types and to reduce the defect levels to prepare the process for high volume manufacturing. Within this process development, SEM-review and defect classification play a key role. This paper provides an overview of the challenges that DSA brings also in this metrology aspect and we will provide successful solutions in terms of making the automated defect review. In addition, a new Real Time Automated Defect Classification (RT-ADC) will be introduced that can save up to 90% in the time required for manual defect classification. This will enable a much larger sampling for defect review, resulting in a better understanding of signatures and behaviors of various DSA specific defect types, such as dislocations, 1-period bridges and line wiggling.

Citation Download Citation

Hari Pathangi, Dieter Van Den Heuvel, Hareen Bayana, Loemba Bouckou, Jim Brown, Paolo Parisi, and Rohan Gosain "The use of eDR-71xx for DSA defect review and automated classification", Proc. SPIE 9424, Metrology, Inspection, and Process Control for Microlithography XXIX, 94242F (19 March 2015); https://doi.org/10.1117/12.2085902

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KEYWORDS

Directed self assembly

Image quality

Bridges

Defect inspection

Inspection

Semiconducting wafers

Scanning electron microscopy

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