Directed self-assembly process integration: fin patterning approaches and challenges

Safak Sayan; B. T. Chan; Taisir Marzook; Nadia Vandenbroeck; Efrain A. Sanchez; Roel Gronheid; Arjun Singh; Paulina R. Delgadillo

doi:10.1117/12.2087318

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20 March 2015 Directed self-assembly process integration: fin patterning approaches and challenges

Safak Sayan, B. T. Chan, Taisir Marzook, Nadia Vandenbroeck, Efrain A. Sanchez, Roel Gronheid, Arjun Singh, Paulina R. Delgadillo

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Proceedings Volume 9425, Advances in Patterning Materials and Processes XXXII; 94250R (2015) https://doi.org/10.1117/12.2087318
Event: SPIE Advanced Lithography, 2015, San Jose, California, United States

Abstract

Directed Self Assembly (DSA) processes offer the promise of providing alternative ways to extend optical lithography cost-effectively for sub-10nm nodes and present itself as an alternative pitch division approach. As a result, DSA has gained increased momentum in recent years, as a means for extending optical lithography past its current limits. The availability of a DSA processing line can enable to further push the limits of 193nm immersion lithography and overcome some of the critical concerns for EUV lithography.

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Safak Sayan, B. T. Chan, Taisir Marzook, Nadia Vandenbroeck, Efrain A. Sanchez, Roel Gronheid, Arjun Singh, and Paulina R. Delgadillo "Directed self-assembly process integration: fin patterning approaches and challenges", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250R (20 March 2015); https://doi.org/10.1117/12.2087318

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