Paper
20 March 2015 Patterning sub-25nm half-pitch hexagonal arrays of contact holes with chemo-epitaxial DSA guided by ArFi pre-patterns
Arjun Singh, Boon Teik Chan, Doni Parnell, Hengpeng Wu, Jian Yin, Yi Cao, Roel Gronheid
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Abstract
The patterning potential of block copolymer (BCP) materials via various directed self-assembly (DSA) schemes has been demonstrated for over a decade. We have previously reported the HONEYCOMB flow; a process flow where we utilize Extreme Ultraviolet Lithography and Oxygen plasma to guide the assembly of cylindrical phase BCPs into regular hexagonal arrays of contact holes [1, 2]. In this work we report the development of a new process flow, the CHIPS flow, where we use ArFi lithography to print guiding patterns for the chemo-epitaxial DSA of BCPs. Using this process flow we demonstrate BCP assembly into hexagonal arrays with sub-25 nm half-pitch and discuss critical steps of the process flow. Additionally, we discuss the influence of under-layer surface energy on the DSA process window and report contact hole metrology results.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Arjun Singh, Boon Teik Chan, Doni Parnell, Hengpeng Wu, Jian Yin, Yi Cao, and Roel Gronheid "Patterning sub-25nm half-pitch hexagonal arrays of contact holes with chemo-epitaxial DSA guided by ArFi pre-patterns", Proc. SPIE 9425, Advances in Patterning Materials and Processes XXXII, 94250X (20 March 2015); https://doi.org/10.1117/12.2086352
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Cited by 5 scholarly publications.
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KEYWORDS
Directed self assembly

Etching

Photoresist materials

Polymethylmethacrylate

Optical lithography

Electron beam lithography

Extreme ultraviolet lithography

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