Characterization of the effect of etch process operating environment on the perfluoroelastomer chamber seal systems

Chinchao Liu; Gary Reichl

doi:10.1117/12.2087324

17 March 2015 Characterization of the effect of etch process operating environment on the perfluoroelastomer chamber seal systems

Chinchao Liu, Gary Reichl

Author Affiliations +

Proceedings Volume 9428, Advanced Etch Technology for Nanopatterning IV; 94280Y (2015) https://doi.org/10.1117/12.2087324
Event: SPIE Advanced Lithography, 2015, San Jose, California, United States

Abstract

Based on semiconductor process conditions such as power, gas, temperature and pressure, proper elastomer seal material selection is vital to maximizing the performance and productivity of wafer process production systems. Numerous metrology and test methods are used to measure the combined performance of elastomer seals. It is extremely important to take into consideration several performance parameters because minute shifts or modifications to process conditions can have detrimental effects on the production process. Weight loss, FTIR, SEM, Laser Confocal Microscope, and ICP/MS are some of the test methods used by Greene, Tweed to predict, with high confidence, the performance of elastomer seals for specific process conditions. This methodology is used to support the semiconductor research and process development community.

Citation Download Citation

Chinchao Liu and Gary Reichl "Characterization of the effect of etch process operating environment on the perfluoroelastomer chamber seal systems", Proc. SPIE 9428, Advanced Etch Technology for Nanopatterning IV, 94280Y (17 March 2015); https://doi.org/10.1117/12.2087324

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