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3 June 2015 Determination of stress in silicon wafers using Raman spectroscopy
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With a strong industrial trend towards using thin silicon in semiconductor devices, process legacy-induced stresses are matter of increasing practical importance. A key problem here is a lack of suitable metrology equipment for measuring inherent substrate material stresses in the manufacturing line. To overcome this, the use of Raman microspectrometry as a tool for measuring stress levels and distributions quantitatively on entire productive wafers was researched. Combining model cases, theoretical considerations and real-world samples, it could be shown that Raman can provide the necessary analytical accuracy and reliability, allowing to relate ensuing stress states e.g. to different wafer thinning process parameters.
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M. De Biasio, L. Neumaier, N. Vollert, E. Geier, M. Roesner, Ch. Hirschl, and M. Kraft "Determination of stress in silicon wafers using Raman spectroscopy", Proc. SPIE 9482, Next-Generation Spectroscopic Technologies VIII, 94820R (3 June 2015);

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