Characterization of cross-spring pivots for micropositioning applications

K. Marković; S. Zelenika

doi:10.1117/12.2178490

21 May 2015 Characterization of cross-spring pivots for micropositioning applications

K. Marković, S. Zelenika

Proceedings Volume 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems; 951727 (2015) https://doi.org/10.1117/12.2178490
Event: SPIE Microtechnologies, 2015, Barcelona, Spain

Abstract

Compliant mechanisms gain at least part of their mobility from the deflection of flexible member. They are characterised by high precision, as well as no backlash and wear. Several analytical and numerical methods are used in this work to characterise the behaviour of compliant rotational mechanisms, known as cross-spring pivots, aimed at micropositioning applications. When ultra-high precision is required, the limits of applicability of approximated calculation algorithms have to be determined. The results obtained by employing these methods are thus compared with results obtained by using nonlinear finite element calculations tuned with experimental data reported in literature. The finite element model allows also considering the influence of lateral loads and of non-symmetrical pivot configurations where the angle or point of intersection of the leaf springs, or even the initial curvature of the springs, can be varied. The aim of this part of the work is to determine the influence of the cited design parameters on the minimisation of the parasitic shifts of the geometric centre of the pivot as well as on the minimisation of the variability of the rotational stiffness of the pivot so as to ensure its stability. The obtained results allow therefore determining design solutions applicable in ultra-high precision micropositioning applications, e.g. in the field of production or of handling and assembly of MEMS.

Citation Download Citation

K. Marković and S. Zelenika "Characterization of cross-spring pivots for micropositioning applications", Proc. SPIE 9517, Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, 951727 (21 May 2015); https://doi.org/10.1117/12.2178490

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