Dielectrophoresis based integration of nanostructures and their sensorial application

Christian Leiterer; Gerald Brönstrup; Steffen Berg; Norbert Jahr; Wolfgang Fritzsche

doi:10.1117/12.2189235

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28 August 2015 Dielectrophoresis based integration of nanostructures and their sensorial application

Christian Leiterer, Gerald Brönstrup, Steffen Berg, Norbert Jahr, Wolfgang Fritzsche

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Proceedings Volume 9555, Optical Sensing, Imaging, and Photon Counting: Nanostructured Devices and Applications; 95550Q (2015) https://doi.org/10.1117/12.2189235
Event: SPIE Nanoscience + Engineering, 2015, San Diego, California, United States

Abstract

Here we present a technique to integrate bottom-up nanostructures for optoelectronic and chemoresistive sensing using an AC electrical field. The work focuses mainly on two types of nanostructured materials: gold nanoparticle and silicon nanowire. In terms of electrical microintegration of these structures, it is especially important to apply a reliable electrical contact with low contact-resistance, in order to be able to use them as optoelectronic or chemo resistive sensors. To achieve this, a micro integration process was developed to achieve this goal. The contacted nanostructures were characterized electrically to optimize the integration procedure and acquire best possible sensing capabilities. Silicon nanowires were demonstrated to work as wavelength sensitive optical sensors and gold nanoparticle as marker free chemo resistive sensor.

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Christian Leiterer, Gerald Brönstrup, Steffen Berg, Norbert Jahr, and Wolfgang Fritzsche "Dielectrophoresis based integration of nanostructures and their sensorial application", Proc. SPIE 9555, Optical Sensing, Imaging, and Photon Counting: Nanostructured Devices and Applications, 95550Q (28 August 2015); https://doi.org/10.1117/12.2189235

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