Paper
4 September 2015 YieldStar based reticle 3D measurements and its application
Vidya Vaenkatesan, Twan Schellekens, Natalia Davydova, Harm Dillen, Joep van Dijk
Author Affiliations +
Proceedings Volume 9661, 31st European Mask and Lithography Conference; 96610N (2015) https://doi.org/10.1117/12.2196665
Event: 31st European Mask and Lithography Conference, 2015, Eindhoven, Netherlands
Abstract
YieldStar (YS) is an ASML-built scatterometry tool with well-established capability to measure wafer Critical Dimension (CD), Overlay and Focus. In a feasibility study, the application range of YS was extended to measure CD patterns in EUV reticles (absorber CD, height, Side Wall Angle-SWA). The measured data compared well with the available data from CD-SEM and AFM. Further the YS measured data was used to mathematically separate the reticle induced fingerprint from the scanner fingerprint.
© (2015) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Vidya Vaenkatesan, Twan Schellekens, Natalia Davydova, Harm Dillen, and Joep van Dijk "YieldStar based reticle 3D measurements and its application", Proc. SPIE 9661, 31st European Mask and Lithography Conference, 96610N (4 September 2015); https://doi.org/10.1117/12.2196665
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KEYWORDS
Reticles

Semiconducting wafers

Critical dimension metrology

Extreme ultraviolet

3D modeling

3D metrology

Ions

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