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22 April 2016 Flexible assembly module for beam-shaping product families based on support structures
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Depending on the application, high-power diode lasers (HPDL) have individual requirements on their beam-shaping as well as their mechanical fixation. In order to reduce assembly efforts, laser system manufacturers request pre-assembled beam-shaping systems consisting of a support structure for adhesive bonding as well as one, two or more lenses. Therefore, manufacturers of micro-optics for HPDL need flexible solutions for assembling beam-shaping subassemblies. This paper discusses current solutions for mounting optical subassemblies for beam-shaping of high-power diode lasers and their drawbacks regarding quality and scalability. Subsequently, the paper presents a device which can be used for the sensor-guided assembly of beam-shaping systems based on bottomtab support structures. Results from test productions of several hundred modules are presented showing that repeatability in the range of 1 μm is feasible on an industrial level.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Sebastian Haag, Olaf Rübenach, Andreas Beleke, Tobias Haverkamp, Tobias Müller, Daniel Zontar, Christian Wenzel, and Christian Brecher "Flexible assembly module for beam-shaping product families based on support structures", Proc. SPIE 9727, Laser Resonators, Microresonators, and Beam Control XVIII, 97270W (22 April 2016);

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