Femtosecond lasers for machining of transparent, brittle materials: ablative vs. non-ablative femtosecond laser processing

F. Hendricks; V. V. Matylitsky

doi:10.1117/12.2212513

9 March 2016 Femtosecond lasers for machining of transparent, brittle materials: ablative vs. non-ablative femtosecond laser processing

F. Hendricks, V. V. Matylitsky

Author Affiliations +

Proceedings Volume 9740, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XVI; 97400Z (2016) https://doi.org/10.1117/12.2212513
Event: SPIE LASE, 2016, San Francisco, California, United States

Abstract

This paper focuses on precision machining of transparent materials by means of ablative and non-ablative femtosecond laser processing. Ablation technology will be compared with a newly developed patent pending non-ablative femtosecond process, ClearShape^TM, using the Spectra-Physics Spirit industrial femtosecond laser.

Citation Download Citation

F. Hendricks and V. V. Matylitsky "Femtosecond lasers for machining of transparent, brittle materials: ablative vs. non-ablative femtosecond laser processing", Proc. SPIE 9740, Frontiers in Ultrafast Optics: Biomedical, Scientific, and Industrial Applications XVI, 97400Z (9 March 2016); https://doi.org/10.1117/12.2212513

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