Progress in high-power high-speed VCSEL arrays

Richard F. Carson; Mial E. Warren; Preethi Dacha; Thomas Wilcox; John G. Maynard; David J. Abell; Kirk J. Otis; James A. Lott

doi:10.1117/12.2215009

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18 March 2016 Progress in high-power high-speed VCSEL arrays

Richard F. Carson, Mial E. Warren, Preethi Dacha, Thomas Wilcox, John G. Maynard, David J. Abell, Kirk J. Otis, James A. Lott

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Proceedings Volume 9766, Vertical-Cavity Surface-Emitting Lasers XX; 97660B (2016) https://doi.org/10.1117/12.2215009
Event: SPIE OPTO, 2016, San Francisco, California, United States

Abstract

Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.

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Richard F. Carson, Mial E. Warren, Preethi Dacha, Thomas Wilcox, John G. Maynard, David J. Abell, Kirk J. Otis, and James A. Lott "Progress in high-power high-speed VCSEL arrays", Proc. SPIE 9766, Vertical-Cavity Surface-Emitting Lasers XX, 97660B (18 March 2016); https://doi.org/10.1117/12.2215009

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