Translator Disclaimer
Paper
18 March 2016 Progress in high-power high-speed VCSEL arrays
Author Affiliations +
Abstract
Flip-chip bonding enables a unique architecture for two-dimensional arrays of VCSELs. Such arrays feature scalable power outputs and the capability to separately address sub-array regions while maintaining fast turn-on and turn-off response times. These substrate-emitting VCSEL arrays can also make use of integrated micro-lenses for beam shaping and directional control. Advances in the performance of these laser arrays will be reviewed and emerging applications are discussed.
© (2016) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Richard F. Carson, Mial E. Warren, Preethi Dacha, Thomas Wilcox, John G. Maynard, David J. Abell, Kirk J. Otis, and James A. Lott "Progress in high-power high-speed VCSEL arrays", Proc. SPIE 9766, Vertical-Cavity Surface-Emitting Lasers XX, 97660B (18 March 2016); https://doi.org/10.1117/12.2215009
PROCEEDINGS
14 PAGES


SHARE
Advertisement
Advertisement
RELATED CONTENT

3D imaging with 128x128 eye safe InGaAs p i n...
Proceedings of SPIE (May 02 2019)
Lidar sensors for autonomous driving
Proceedings of SPIE (March 02 2020)
Disruptive laser diode source for embedded LIDAR sensors
Proceedings of SPIE (February 22 2017)
Design and field testing of a 1.5 um active TV...
Proceedings of SPIE (July 26 1999)

Back to Top